Wire Bonder Instructions

Things to have ready:

1. Packaged die

Procedure:

1. Turn on power button for ultrasonic unit (White button)
2. Turn on power for mechanical unit (Switch near control lever)
3. Install wire bonding needle, press test button to see if properly installed (Auto Tune goes green)
4. Use tweezers to thread wire through the needle
5. Line up first bond
6. Lower control arm till it hits the table
7. Raise control arm until needle rises just above the chip
8. Move platform control to next bonding location
9. Lower control arm till it hits the table
10. Raise control arm and wire should break

procedure prepared by Francisco Tejada, Spring 2003; modified by La Vida Cooper, Spring 2003.