Fall 2007

Staff
Professor Andreas G. Andreou, 400 Barton Hall, 410-516-8361 (agaclass at gmail dot edu)
Professor Jeff Tza-Huei Wang, 108 Latrobe Hall, 410-516-7086 (thwang at jhu dot edu)
Mr. Huy Vo, Lab manager, 118 Clark Hall, 410-516-4048 (huyvo at bme dot jhu dot edu)
 
Teaching and Laboratory Assistants
Vasudev Bailey, T.A. (baileyv at gmail dot com)
David Ellison, T.A. (daviddellison at gmail dot com)
Lan Le,  Laboratory Assistant (lanle at jhu dot edu)
Recep Ozgun, Laboratory Assistant (recep at jhu dot edu)

Course Logistics

Course Ethics

Homework and pre-laboratory assignments: In a laboratory course, you have ample opportunities for collaboration. Developing the ability to work within a group is certainly one of the objectives for this course. However, homework assignments, pre-lab write-ups and examinations must be done on your own. Please read here what you are supposed to do alone and how much you are allowed to collaborate.

Laboratory safety and environment awareness: When working in the lab you must follow all proper procedures to avoid injuring yourself or anyone else that works with you. When disposing chemical waste it is important that you follow proper laboratory procedures to assure that our environment stays clean and free from contaminants. Please read the Laboratory Safety handout, and revisit it periodically to refresh yourself and especially when in doubt about a particular process or procedure. After  reading the Laboratory Safety handout please download, print and sign the pledge to be a good lab citizen and follow all safety rules and regulations. The signed pledge must be handed in with the first homework assignment.

Textbook

The Science and Engineering of Microelectronic Fabrication 2nd Edition,

Stephen A. Campbell, Oxford University Press, 2001.

Errata to the 2nd Edition (local copy)
Schedule and Syllabus

To accommodate the large number of students enrolled in this course, two lab projects will be run in parallel. The two projects are: optical waveguides and the flow cytometer. These have similar process flows but are staggered in such a way to avoid conflicts with major equipment and instrumentation. In the laboratory schedule shown in the table below,  Lab #X_WG refers to the  optical waveguides and  Lab #X_CY to the  flow cytometer.

 

Week

Lecture topics

Laboratory session

1

Organizational meeting; (September 6th, 2007)

No laboratory session

2

Handout  #1a (Introduction to Microfabrication)

Handout #1b (Clean room training)

Review of safety and clean room procedures

Reading: Book Chapter 1

 Lab #1a 

Laboratory orientation and instrumentation

3

Handout  #2a

Handout  #2b (Flow Cytometer on a Chip)

Handout  #2c  (Optical Waveguides in Silicon)

Reading: book chapter 2 sections 2.2, 2.4 and 2.7

Lab #1b

CAD tools and mask design

Lab1bFiles (zip)

(Account passwords for computer lab will be given to students by T.As. during lab sections)

4

 Handout #3 (Thermal Oxidation)

Reading: book chapter 4 sections 4.1, 4.2, 4.3, 4.4, 4.9

Lab #2_FC (Lithography I)

Lab #2_WG (Oxidation I)

5

 Handout  #4 (Photolithography I)

Reading: book chapter 7 sections 7.1, 7.2, 7.3, 7.4, 7.5, 7.6, 7.9, 7.10

 Lab #3_FC (KOH Etch)

Seidel Paper

Lab #3_WG (Lithography I)

6

 Handout #5 (Photolithography II)

Reading: book chapter 8 sections 8.1, 8.2, 8.3, 8.4, 8.5, 8.6, 8.9; book chapter 9 sections 9.1, 9.2, 9.3

 Lab #4_FC (Oxidation II)

Lab #4_WG (KOH Etch)
7 Handout  #6a (Etching I: Wet Etching) 

Reading: book chapter 11 section 11.1; book chapter 19 section 19.5, Petersen paper section III, Williams/Muller paper, Madou handout

 

 

 Lab #5_FC (Aluminum Evaporation)

Lab #5_WG (Oxidation II)

8

 Handout #7 (Thin Film Deposition)

Reading:  book chapter 12 section 12.1, 12.2, 12.3, 12.4, 12.5, 12.6, 12.7, 12.14; book chapter 13 section 13.1, 13.2

 Lab #6_FC (Lithography II; Metal Patterning)

Lab #6_WG (Shadow Mask Aluminum Evaporation)

 

9

 Midterm Examination

(Thursday November 1st)

 Lab #7_FC (Lithography III; Oxide Removal)

Lab #7_WG (SU-8 deposition and patterning)

 

10

 Handout #8 (Etching II: Dry Etching)

Reading:  book chapter 11 section 11.3, 11.4, 11.5, 11.6, 11.7, 11.10

 Lab #8_FC (Anoding Bonding)

Lab #8_WG (Wafer Dicing)

 

11

 Handout  #9 (Diffusion, Ion-implantation)

Reading:  book chapter 3 section 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.8; book chapter 5 section 5.1, 5.2, 5.3, 5.8

 Lab #10_FC (Testing)

Lab #10_WG (Testing)

12

 Handout #10

(CMOS and MEMS Technologies)

Handout #11

(Packaging and Advanced Packaging)

Reading:  book chapter 16, sections 16.1, 16.2, 16.3, 16.4; book chapter 19 sections 19.6, 19.7, 19.8, 19.9

  Testing

13

Project presentation and discussion

  

 

Equipment Use Guide

uFab Lab Kiosk: prepared by La Vida Cooper (2002). Please send comments to the lab manager Mr. Huy Vo.

Homework Assignments and Solutions

Homeworks Topic Solutions
Homework # 1: Due 9/20/2007 Cleanroom safety Homework #1
Homework # 2: Due 9/27/2007 CAD and mask design Homework #2
Homework # 3: Due 10/11/2007 Oxidation Homework #3 
Homework # 4: Due 10/11/2007 Photolithography I Homework #4
Homework # 5: Due 10/18/2007 Photolithography II Homework #5
Homework # 6: Due 10/25/2007 Wet etching Homework #6
Homework # 7: Due 11/1/2007 Thin film deposition Homework #7
Midterm Examination

11/1/2007

 In class examination, open notes, open books on all topics up to and including thin film deposition. Students are also expected to answer questions on the lab work and their lab project. Make sure you have  handouts posted on the web for material not in the book.  
All homework assignments are due at 11.00 a.m. in class

Final Project assignment: 11/8/2007

Absolutely no extensions!

Final project report : Due: 5.00 p.m. Monday December 10th. 

PLEASE SEND ELECTRONIC VERSION (pdf and excel files) TO jhu495 at gmail dot com, or jhu773 at gmail dot com if you are enrolled in the graduate level course.. Please use your last name as the name of the files. For example andreou.pdf and andreou.xls

In class presentation

All class presentations will be done during the laboratory times for the respective groups (5th, 6th and 7th of December). Please meet with the Professors in the area outside the cleanroom and have your presentation on a USB stick. Please also bring one hard copy of your presentation that will be handed in.

Unless requested otherwise, hardcopy submission of homework is due at the beginning of the Thursday lecture. Electronic submission  will not be accepted without permission.

Solutions will be posted for a period of one week and they are password protected.

CAD Tools

Computer aided design is playing an important role in the development of the microelectronics industry. Sophisticated programs are necessary to do mask layout, to simulate the fabrication process, as well as the devices and circuits. At the system level CAD tools are also employed in high level synthesis of complex systems such as modern day microprocessors and graphics chips. For more information see our CAD tools page.

Frequently Asked Questions

How do I ... , where can I find ... , what is ... , ?

Reading References

1. Introduction to Microelectronic Fabrication, 2nd Edition, Richard C. Jaeger, Volume V;  Modular Series on Solid State Devices , G. W. Neudeck and R.F. Pierret eds., Prentice Hall, 2002.

2. Fundamentals of Microfabrication : The Science of Miniaturization, Marc J. Madou, CRC Press, 2nd edition, 2002.

3. Fundamentals of Semiconductor Fabrication, Gary S. May, Simon M. Sze, Wiley Publishers,  April 2003.

4. Silicon as Mechanical Material , K. E. Petersen, Proceedings of  IEEE, vol. 70, no. 5, pp. 420-457, May 1982 (pdf).

5. The 1.7 Kilogram Microchip: Energy and Material Use in The Production of Semiconductor Devices, E. D. Williams, R.U. Ayres, and M. Heller (pdf). Supplementary information (pdf) and Nature editorial on this article (pdf).

Related JHU Links

Andreou Lab

Wang Lab

Gracias Lab

Whitaker Lithography and Fabrication Lab

520/530.773 Advanced Topics in Fabrication and Microengineering

520/530.487 Introduction to Microelectromechanical Systems (MEMS)

540.440/540.640 Chemical Engineering for Micro and Nano Technology

Bibliography

A collection of articles from previous years

Lithography Processing Packaging/Assembly CAD Testing MEMS Nano

 

Microfabrication, MEMS and Soft-Lithography Links

MEMS clearing house (MOSIS) MEMSCAP foundry (used to be Cronus) MEMS Exchange UC Irvine
MIT U.C. Berkeley University of Michigan Caltech
George Washington      
U.C. Davis University of Washington Loughborough University Whitesides Group

Equipment and Supplies Links

MOSIS MICROCHEM Corp (SU-8 photoresist supplier) SOTEC Microsystems (SU-8 photoresist supplier)
Transene (etching, plating, cleaning solutions) Small Parts (tubing, solder and alloys) Technic Inc (plating solutions)
ExpressPCB (printed circuit board software and manufacturing) Wafer World (small diameter wafers for silicon and other compounds) R.D Mathis (Evaporator supplies, boats, materials)
SU8-Website (information on SU-8 photoepoxy) Memscyclopedia (not much now but hopefully it will expand!)  
Valley Design (dicing, lapping polishing) Pelchem (semiconductor products, XeF2) Ziptronix (packaging and integration)

 

Acknowledgements

This course is supported by a Whitaker Foundation Development grant and by Kenan grants from the Whiting School of Engineering. 
Page maintained by A.G. Andreou, andreou at jhu.edu , Last update: Wednesday, September 09, 2009