StaffProfessor Andreas G. Andreou, 120 Stieff Building, 410-516-8361 (agaclass at gmail dot edu) Professor Jeff Tza-Huei Wang, 108 Latrobe Hall, 410-516-7086 (thwang at jhu.edu) Mr. Huy Vo, Lab manager, 118 Clark Hall, 410-516-4048 (huyvo at bme.jhu.edu) Teaching and Laboratory Assistants Beatriz Olleta, Teaching Assistant, 120 Stieff Building, 410-516-0258 (b.olleta at ieee.org) Francisco Tejada, Laboratory Assistant, 120 Stieff Building, 410-516-0258 (ft1 at jhu.edu) David Noren, Laboratory Assistant, 410-516-6241, (david.noren at gmail.com) Stanley Chao, Laboratory Assistant, 410-516-4746 (schao5 at jhu.edu)Course Logistics
Course EthicsHomework and pre-laboratory assignments : In a laboratory course, you have ample opportunities for collaboration. Developing the ability to work within a group is certainly one of the objectives for this course. However, homework assignments, pre-lab write-ups and examinations must be done on your own. Please read here what you are supposed to do alone and how much you are allowed to collaborate.Laboratory safety and environment awareness: When working in the lab you must follow all proper procedures to avoid injuring yourself or anyone else that works with you. When disposing chemical waste it is important that you follow proper laboratory procedures to assure that our environment stays clean and free from contaminants. Please read the Laboratory Safety handout, and revisit it periodically to refresh yourself and especially when in doubt about a particular process or procedure. After reading the Laboratory Safety handout please download, print and sign the pledge to be a good lab citizen and follow all safety rules and regulations. The signed pledge must be handed in with the first homework assignment. |
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Textbook
Fundamentals of Semiconductor Fabrication
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Schedule and Syllabus To accommodate the large number of students enrolled in this course, two lab projects will be run in parallel. The two projects are: optical waveguides and the flow cytometer. These have similar process flows but are staggered in such a way to avoid conflicts with major equipment and instrumentation. In the laboratory schedule shown in the table below, Lab #X_WG refers to the optical waveguides and Lab #X_CY to the flow cytometer.
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Week |
Lecture topics |
Laboratory session |
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1 |
Organizational meeting; (September 2nd, 2004) |
No laboratory session |
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2 |
Handout #1a (Introduction to Microfabrication) Handout #1b (Clean room training) Review of safety and clean room procedures Reading: Chapter 1 |
Lab #1a Laboratory orientation and instrumentation |
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3 |
Handout #2b (Flow Cytometer on a Chip) Handout #2c (Optical Waveguides in Silicon) Reading: Chapter 2.1, 2.1.1, 2.4, 2.5, Handout #2a, Handout #2b and Handout #2c |
CAD tools and mask design Lab1bFiles (zip) |
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4 |
Handout #3 (Thermal Oxidation) |
Lab #2_FC (Lithography I) Lab #2_WG (Oxidation I) |
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5 |
Handout #4a (Photolithography I) Reading: Chapter Chapter 4.1, Chapter 2 in Jaeger (Handout #4b); password given in class. |
Lab #3_FC
(KOH Etch)
Lab #3_WG (Lithography I) |
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6 |
Handout #5a,
Handout #5b,
Handout #5c (Etching I: Wet Etching) |
Lab #4_FC
(Oxidation II) Lab #4_WG (KOH Etch) |
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7 |
Handout #6 (Thin Film Deposition) Reading: Appendix H, chapter 8.1., 8.1.1, 8.1.2, 8.3, 8.3.1, 8.4, 8.5, 8.5.1, 8.5.2, 8.5.3, 8.5.4. |
Lab #5_FC
(Aluminum Evaporation) Lab #5_WG (Oxidation II) |
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8 |
Handout #7 (Etching II: Dry Etching) |
Lab #6_FC
(Lithography II; Metal Patterning) Lab #6_WG (Shadow Mask Aluminum Evaporation) |
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9 |
Handout #8 (Diffusion, Ion-implantation) Reading: Chapter 6.1, 7.1 |
Lab #7_FC
(Lithography III; Oxide Removal) Lab #7_WG (SU-8 deposition and patterning) |
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10 |
Handout #9
(CMOS and MEMS Technologies) Reading: Chapter 9.1, 9.2, 9.3, 9.4, 9.5 |
Lab #8_FC (Anoding Bonding) Lab #8_WG (Wafer Dicing) |
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11 |
Handout #10 (Photolithography II: Soft-lithography) |
Lab #10_FC (Testing) Lab #10_WG (Testing) |
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12 |
Handout #10a,
Handout #10b (Packaging and Advanced Packaging) |
More Testing |
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13 |
Project presentation and discussion |
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Equipment Use Guide uFab Lab Kiosk: prepared by La Vida Cooper (2002). Please send comments to the lab manager Mr. Huy Vo. Homework Assignments and Solutions
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CAD Tools Computer aided design is playing an important role in the development of the microelectronics industry. Sophisticated programs are necessary to do mask layout, to simulate the fabrication process, as well as the devices and circuits. At the system level CAD tools are also employed in high level synthesis of complex systems such as modern day microprocessors and graphics chips. For more information see our CAD tools page. Frequently Asked Questions How do I ... , where can I find ... , what is ... , ? Reading References 1. Introduction to Microelectronic Fabrication, 2nd Edition, Richard C. Jaeger, Volume V; Modular Series on Solid State Devices , G. W. Neudeck and R.F. Pierret eds., Prentice Hall, 2002. 2. Fundamentals of Microfabrication : The Science of Miniaturization, Marc J. Madou, CRC Press, 2nd edition, 2002. 3. The Science and Engineering of Microelectronic Fabrication 2nd Edition, Stephen A. Campbell, Oxford University Press, 2001. 4. Silicon as Mechanical Material , K. E. Petersen, Proceedings of IEEE, vol. 70, no. 5, pp. 420-457, May 1982 (pdf). 5. The 1.7 Kilogram Microchip: Energy and Material Use in The Production of Semiconductor Devices, E. D. Williams, R.U. Ayres, and M. Heller (pdf). Supplementary information (pdf) and Nature editorial on this article (pdf). Related JHU Links Whitaker Lithography and Fabrication Lab 520.773 Advanced Topics in Fabrication and Microengineering 520/530.487 Introduction to Microelectromechanical Systems (MEMS) 540.440/540.640 Chemical Engineering for Micro and Nano Technology Bibliography A collection of articles from previous years
Microfabrication, MEMS and Soft-Lithography Links Equipment and Supplies Links
Acknowledgements This course is supported by a Whitaker Foundation Development grant and by Kenan grants from the Whiting School of Engineering. Page maintained by A.G. Andreou, andreou at jhu.edu , Last update: Thursday, October 04, 2007 |