Professor Andreas G. Andreou, Stieff Bldg. 120, 410-516-8361 John Tan, Teaching Assistant, 443-695-3414, jtan@bme.jhu.edu Jennifer Blain, Laboratory Assistant, Stieff Bldg. 120, 410-516-0258, blain@jhu.edu Francisco Tejada, Laboratory Assistant, Stieff Bldg. 120, 410-516-0258, ft1@jhu.edu
Homework and pre-laboratory assignments
: In a laboratory course, you have ample opportunities for collaboration. Developing the ability to work within a group is certainly one of the objectives for this course. However, homework assignments, pre-lab write-ups and examinations must be done on your own. Please read here what you are supposed to do alone and how much you are allowed to collaborate.Laboratory safety and environmental awareness: When working in the lab you must follow all proper procedures to avoid injuring yourself or anyone else that works with you. When disposing chemical waste it is important that you follow proper laboratory procedures to assure that our environment stays clean and free from contaminants. Please read the Laboratory Safety handout, and revisit it periodically to refresh yourself and especially when in doubt about a particular process or procedure. After reading the Laboratory Safety handout please download, print and sign the pledge to be a good lab citizen and follow all safety rules and regulations. The signed pledge must be handed in with the first homework assignment.
Textbook
|
Introduction to Microelectronic Fabrication Second Edition Volume V; Modular Series on Solid State Devices G. W. Neudeck and R.F. Pierret eds. Prentice Hall, 2002. ISBN 0-201-44494-1 |
Introduction to Microelectronic Fabrication Volume V; Modular Series on Solid State Devices G. W. Neudeck and R.F. Pierret eds. Addison-Wesley, 1993. ISBN 0-201-14695-9 |
Schedule and Syllabus
|
Week |
Lecture topics and reading |
Laboratory session |
|
1 |
Organizational meeting; Introduction to the course |
No laboratory session |
|
2 |
Review of safety and clean room procedures Handout #1b (Clean room training) |
Lab #1 Laboratory microscope and profilometer |
|
3 |
Introduction to microfabrication Handout #2 |
Wafer oxidation |
|
4 |
Thermal oxidation of silicon (Chapter 3) |
CAD tools and mask design. Download the classframe file here |
|
5 |
Film deposition (Chapter 6.1, 6.2) |
Aluminum deposition and photoresist coating |
|
6 |
Photolithography (I): Basic (Chapter 2) |
Photolithography; aluminum patterning |
|
7 |
Etching (Silicon as Mechanical Material, Section III; K. Petersen) |
Metal annealing and SU-8 coating. Find good information on SU-8 processing on this web site. |
|
8 |
Photolithography (II): Advanced topics, |
Photolithography; SU-8 patterning |
|
9 |
Plating ( Electrochemistry, Chapter by S.K. Lower) |
Immersion Silver plating |
|
10 |
Packaging (Chapter 8) Advanced packaging; J. Carson of Irvine Sensors. |
Lab #9 Wafer dicing and packaging We use this design for a printed circuit board. The wafer map (mask) is here. |
|
11 |
CMOS and CMOS MEMS (Chapters 9) |
Device chloriding |
|
12 |
BioMEMS and some applications Prof. Jeff Wang, Mechanical Engineering Department Guest Lecturer (Handout will be given in the class) |
Lab #11 CAD for CMOS and MEMS |
| 13 | Thanksgiving Holiday |
|
|
14 |
Project presentation and discussion |
No laboratory session (optional experiment with your device) |
Some of the lecture handout notes come from Robert Darling's excellent process tutorials.
CAD Tools
The CAD program LEDIT will be used for mask design.
Homework Assignments and Solutions
| Homework #1: Due 9/26/2002 | Solutions to Homework #1 |
| Homework # 2: Due 10/3/2002 | Solutions to Homework #2 |
| Homework # 3: Due 10/10/2002 | Solutions to Homework #3 |
| Homework # 4: Due 10/17/2002 | Solutions to Homework #4 |
| Midterm exam (take home): Due 10/24/2002 | Midterm exam solutions will be discussed during lecture period the week following the exam. |
| No Homework due on 10/31/2002 and 11/07/2002 | |
| Homework # 5: Due 11/14/2002 | Solutions to Homework #5 |
| Homework # 6: Due 11/21/2002 | Solutions to Homework #6 |
|
Class presentation: 12/05/2002 (Cancelled; school closed) All presentations will be done on 12/6/2002 beginning at 10 p.m. |
Solutions to Homeworks will be posted for a period of two weeks from the due date. |
|
Final
project Reading material is here |
Due to the snow storm, final report due Monday 12/09/02 at noon in the ECE department office. |
Frequently Asked Questions
How do I ... , where can I find ... , what is ... , ?
Reading References
1. Introduction to Microelectronic Fabrication, 2nd Edition, Richard C. Jaeger, Volume V; Modular Series on Solid State Devices , G. W. Neudeck and R.F. Pierret eds., Prentice Hall, 2002.
Silicon as Mechanical Material , K. E. Petersen, Proceedings of IEEE, vol. 70, no. 5, pp. 420-457, May 1982 (pdf).3. Electrochemistry, S.K. Lower, Simon Fraser University (pdf)
4. Soft Lithography, Y. Xia and George M. Whitesides, Angewandte Chemie, International Edition, 37, 550-575, 1998 (pdf).
5. The 1.7 Kilogram Microchip: Energy and Material Use in The Production of Semiconductor Devices, E. D. Williams, R.U. Ayres, and M. Heller (pdf). Supplementary information (pdf) and Nature editorial on this article (pdf).
Bibliography
A collection of articles from previous years
Related JHU Courses
520.773 Advanced Topics in Fabrication and Microengineering
520/530.487 Introduction to Microelectromechanical Systems (MEMS)
Microfabrication, MEMS and Soft-Lithography Links
Equipment and Supplies Links
MOSIS MICROCHEM Corp (SU-8 photoresist supplier) SOTEC Microsystems (SU-8 photoresist supplier) Transene (etching, plating, cleaning solutions) Small Parts (tubing, solder and alloys) Technic Inc (plating solutions) ExpressPCB (printed circuit board software and manufacturing) Wafer World (small diameter wafers for silicon and other compounds) R.D Mathis (Evaporator supplies, boats, materials) Valley Design (dicing, lapping polishing) SYBORG (Affordable process development and simulation software) Gamry Instruments (Electrochemical measurements)
Acknowledgements
This course is supported by a Whitaker Foundation Development grant and by Kenan grants from the Whiting School of Engineering.
