520.494/580.495 Microfabrication Laboratory

Homework Assignment

Microelectronic Fabrication and MOS Technology

Reading: Chapter 1.1, 1.2, 1.3  and Chapter 9 of Jaeger (1st or 2nd edition)

Questions:

Note: When problem number  in the 2nd edition of the book differs from the 1st edition, the corresponding 2nd edition number is shown in parenthesis.

Q1: An 18 x 18 mm die is covered by an array of 0.26 micron metal lines separated by 0.26 micron wide spaces. (a) What is the total length of the wire on this die (b) How about if we have 0.13 micron wide lines and spaces.

Q2: The cost of processing a wafer in a particular process is about $1,000. Assume that 35% of the fabricated dice are good. Find  the total number of 10 x 10 mm dice in a 100, 150 and 300 mm diameter wafer. Plot the cost per die as a function of the wafer size. What do you conclude from this?

Q3-7: 9.1, 9.2, 9.7(9.16), 9.8(9.17), 9.13(9.23)