|
520/580.495 Microfabrication Laboratory This laboratory course introduces the principles used in the fabrication of microelectronic devices, sensors, and micromechanical structures. Students will work in the laboratory on the fabrication and testing of a bulk micromachined silicon pressure sensor. Accompanying lecture material covers basic processing steps, design and analysis CAD tools, and national foundry services. |
|
Fall 1998
Lectures: Th 9-10, 310 Maryland Hall
Lab section I: Th 10-2, Whitaker Microfabrication Lab - New Engineering Building 213
Lab section II: Fr 9-1 Whitaker Microfabrication Lab - New Engineering Building 213
Lab section III: Fr 1-5 Whitaker Microfabrication Lab - New Engineering Building 213
Staff
Professor Andreas G. Andreou, Latrobe 229, 410-516-8361,
Zaven Kalayjian, (Teaching Assistant) Latrobe 226, 410-516-0258,
zaven@olympus.ece.jhu.eduMichael G. Erickson, (Teaching Assistant/Grader)
erickson@bme.jhu.eduGrading
(20%) Weekly homework problems,
(30%) Written, mid-term examination
(30%) Written, final project report
(20%) Laboratory participation and lab-book
You can read
here what is that you are suppose to submit every week in terms of laboratory writeups.WWW
Course Website: http://www.ece.jhu.edu/faculty/andreou/495
Textbooks
Richard C. Jaeger, Introduction to Microelectronic Fabrication, Addison-Wesley. Additionally, lecture notes and journal articles will be handed out as appropriate.
CAD Tools
Some of the laboratory, may require the use of
LEDIT, mask layout program.Schedule and Syllabus
|
Week |
Lecture topic(s) |
Laboratory session |
|
1 |
Organizational meeting, overview of microelectronic fabrication (Chapter 1), silicon for MEMS, K.E. Petersen 1982 paper |
|
|
2 |
Laboratory safety, laboratory protocols |
Lab # 1 Tour of laboratory and equipment, microscopy, profilometry. |
|
3 |
Project description; Samaun et.al. 1973 paper |
Lab # 2
CAD tools and mask design. |
|
4 |
Thermal oxidation of silicon (Chapter 3) Photolithography I (Chapter 2) Lecture Notes |
Lab # 3
Wafer oxidation. |
|
5 |
Diffusion (Chapter 4) |
Lab # 4
Boron diffusion, piezo-resistor formation. |
|
6 |
Etching; wet, chemical and plasma H. Seidel 1987 paper , K.E. Petersen 1982 paper |
Lab # 5
Anisotropic etching, membrane formation. |
|
7 |
Photolithography II (Chapter 2) |
Lab # 6
Wafer characterization, contact cuts formation. |
|
8 |
Film deposition (Chapter 6) |
Lab # 7
Aluminum deposition, contact and interconnect formation. |
|
9 |
Mid-term examination |
Lab # 8
Wafer electrical characterization. |
|
10 |
Ion implantation (Chapter 5) |
Lab # 9
Wafer dicing, packaging, bonding. |
|
11 |
Die processing and packaging (Chapter 8) |
Lab # 10
Microsensor testing and characterization |
|
12 |
CMOS and CMOS compatible MEMs technologies |
|
|
13 |
Thanksgiving |
|
|
14 |
Projects presentation and discussion |
Note: The laboratory sessions may be shifted as one or more steps in the process may have to be repeated.
Homework Assignments
Homework #1 Homework # 2 Homework # 3 Homework # 4 Homework # 5 Homework # 6References
Useful Local Links
Links to Microfabrication and MEMS at Universities
Acknowledgements
This course has been supported by a Whitaker Foundation Development grant and by a Kenan grant from the Whiting School of Engineering.
As of today (10/12/1998), thanks to the generous support of the Whitaker foundation, this course has a new home; a real clean room in the Biomedical Engineering Institute (to be) at Homewood campus
To see a tentative layout for the new facility click
here!Page maintained by A.G. Andreou,
andreou@jhu.edu , Last update: October 12, 1998